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Call for Papers: Second Workshop on Isolation and Integration in Embedded Systems (IIES 2009)

(document as PDF: )
University of Erlangen-Nuremberg, Nürnberg, Germany
March 31st, 2009
Sponsored by ACM SIGOPS

                   EuroSys 2009 ACM SIGOPS Workshop on 

              Isolation and Integration in Embedded Systems
                              (IIES 2009)


                      --- Call for Contributions ---


Embedded systems developers today are confronted with a large variety
of challenges in the design and implementation of a system. Issues
such as co-location of different applications on a single hard- or
software platform ("co-habitation"), platform integration of different 
embedded operating environments as well as safety and protection of 
embedded software systems require novel approaches to embedded systems
development as well as the adaptation of technologies from mainframe
and desktop computing, like virtualization and emulation. This, in
turn, will change traditional embedded design processes to include
hardware and software of growing complexity. 

This workshop aims to bring together researchers and developers from
all areas of embedded systems in order to create a lively discussion of 
these novel approaches in integration and isolation of embedded systems 
and the associated challenges and prospects.

Suggested topics for papers and discussion include, but are not 
restricted to:

- Virtualization in embedded systems
- System support for temporal and spatial isolation of system-level 
  and application code in embedded systems
- Interaction and resource sharing between isolated components
- System- and language-based isolation techniques 
- Configurable isolation mechanisms
- Lightweight address space models for isolation 
  and similar architectural ffeatures
- Isolation mechanisms and resource constraints -- memory, 
  energy, performance
- Optimization of complex co-habitated embedded systems
- Platform integration of embedded systems
- Preservation of temporal constraints in isolated and integrated 
- Integration of legacy embedded systems in new designs
- Experience reports and details on performance, energy and cost 


Prospective participants of the workshop are asked to submit a position
paper or experience report (3 to 6 pages). Submission of industry 
papers is particularly encouraged. All papers must be written in 
English. The papers should be submitted in PDF format by January 19th, 
2009.  Detailed submission instructions can be found at the workshop 
web site.

Attendance to the workshop is limited to facilitate lively discussions. 
Participation will be by invitation only, based on the program 
committee's evaluation of the submission. Accepted participants will 
be notified by February 16th, 2009.

Accepted position papers will be distributed among the participants 
electronically prior to the workshop. More detailed information will 
be available at the IIES home page.

Camera-ready versions of all accepted papers have to be submitted by 
March 2nd, 2009. Detailed instructions will be emailed to the authors.


January 19, 2009 -- position paper submission by email

February 16, 2009 -- notification of acceptance

March 2, 2009 -- submission of camera-ready versions


This workshop will be highly interactive. Accepted papers will be 
posted on the workshop website ahead of the venue and participants 
are expected to familiarize themselves with the topics presented. 
In particular, participants should prepare questions, comments and a 
list of suggested improvements for the authors of topics they are 
interested in.  

To prepare a special collaborative work session the organizers will 
use the position papers and the input by the participants to compile 
a list of questions, which will be discussed and answered during the 
workshop in discussion groups.  The list can be extended or changed 
during the workshop, if the discussion brings up additional interesting


Presented papers will be published electronically in the ACM Digital
Library and in a printed version as a technical report.


Michael Engel, TU Dortmund, Germany
Jörg Nolte, TU Cottbus, Germany 

  Last modified: 2009-01-19   OS